SKU: 47337069725
Ships within 48 hours · Estimated delivery Aug 23 - Aug 28
The latest design defoaming door
Shockproof Foam
Preset functions
World-famous Chinese Miracle-2 software for MTK / MediaTek
Working distance: 50~155mm
PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC The latest design defoaming doorPHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board
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